A semiconductor packaging tool that triples communication speeds between computer chips and a printed solar panel lighter than a can of soft drink have received funding through the federal government’s Industry Growth Program.
Australian National University spinout Syenta and Kardinia Energy secured a combined $6.9 million in grants last month to commercialise and scale their respective technologies.
Syenta, formerly known as Spark3D, landed the bulk of the funding ($4.75 million) …
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